JPH03781B2 - - Google Patents

Info

Publication number
JPH03781B2
JPH03781B2 JP58032979A JP3297983A JPH03781B2 JP H03781 B2 JPH03781 B2 JP H03781B2 JP 58032979 A JP58032979 A JP 58032979A JP 3297983 A JP3297983 A JP 3297983A JP H03781 B2 JPH03781 B2 JP H03781B2
Authority
JP
Japan
Prior art keywords
lead
film carrier
metal layer
bonding tool
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58032979A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59159538A (ja
Inventor
Junichi Okamoto
Kenzo Hatada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP58032979A priority Critical patent/JPS59159538A/ja
Publication of JPS59159538A publication Critical patent/JPS59159538A/ja
Publication of JPH03781B2 publication Critical patent/JPH03781B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP58032979A 1983-03-02 1983-03-02 ボンデイングツ−ル Granted JPS59159538A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58032979A JPS59159538A (ja) 1983-03-02 1983-03-02 ボンデイングツ−ル

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58032979A JPS59159538A (ja) 1983-03-02 1983-03-02 ボンデイングツ−ル

Publications (2)

Publication Number Publication Date
JPS59159538A JPS59159538A (ja) 1984-09-10
JPH03781B2 true JPH03781B2 (en]) 1991-01-08

Family

ID=12373998

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58032979A Granted JPS59159538A (ja) 1983-03-02 1983-03-02 ボンデイングツ−ル

Country Status (1)

Country Link
JP (1) JPS59159538A (en])

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61158154A (ja) * 1984-12-28 1986-07-17 Matsushita Electric Ind Co Ltd 加熱圧着ツ−ル
KR0186084B1 (ko) * 1995-09-02 1999-04-15 문정환 히팅장치를 구비한 웨지 공구
CN114883286B (zh) * 2022-06-08 2024-08-20 江西蓝微电子科技有限公司 一种金银合金复合键合丝及其制造方法

Also Published As

Publication number Publication date
JPS59159538A (ja) 1984-09-10

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